ELECTRONIC COMPONENT FOR WIRING AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To simply and inexpensively manufacture an electronic device package by concentrating processes requiring a facility close to a previous process on components offline without requiring a penetration electrode technology.SOLUTION: An electronic component for wiring is used by being mounted in an electronic device package where a circuit element including a semiconductor chip is arranged, the circuit element is connected to its backside wiring pattern, and the electronic device package is connected to external electrodes positioned on a surface opposed to the wiring pattern via vertical wiring. The electronic component for wiring comprises: a conductive supporting part as electro-casting matrix material; and a plurality of vertical wiring parts constituted by being integrally coupled on the supporting part by an electro-casting method.