| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a protective organic solderability preservative (OSP) which protects copper surfaces of a printed circuit board and has favorable thermal stability and deposition selectivity.SOLUTION: Solderability of electrical connections between components in an electronic apparatus is improved by compositions comprising: one or more sources of metal ions selected from copper salts, tin salts, zinc salts, silver salts, nickel salts, lead salts, barium salts, manganese salts, iron salts and palladium salts; one or more acids; and one or more compounds having the specified formula.</p> |
