摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate which, although a thick ceramic multilayer substrate, has a small warp or undulation, and is suitable for a probe card. ! SOLUTION: A probe card-use ceramic multilayer substrate 100 pertaining to the present invention comprises: a substrate body 110 created by laminating a plurality of ceramic layers and having first and second principal surfaces 111, 112; and an internal wiring 113 and a via conductor 114 formed inside the substrate body 110. The probe card-use ceramic multilayer substrate is characterized in that at least one recess 120 is formed on the side surface of the substrate body 110 by reducing the outer shape of at least one or more ceramic layers other than a first ceramic layer 130 and a second ceramic layer 139, and at least some via conductor among second via conductors 149 is formed on the outside of a first via conductor formation region 165. ! COPYRIGHT: (C)2014,JPO&INPIT |