发明名称 Housing for a Semiconductor Chip and Semiconductor Chip with a Housing
摘要 A housing for a semiconductor chip has an injection molded body, in which an accommodating area for accommodating the semiconductor chip is provided. The injection-molded body has at least one metallization for making electrical contact with the semiconductor chip.
申请公布号 US2014217523(A1) 申请公布日期 2014.08.07
申请号 US201214127451 申请日期 2012.07.26
申请人 Kubiak Michael 发明人 Kubiak Michael
分类号 H01L23/045;H01L29/84 主分类号 H01L23/045
代理机构 代理人
主权项
地址 Berlin DE