WAFER GRINDING APPARATUS

摘要

The present invention relates to a wafer polishing apparatus having an improved structure to be able to accurately measure the thickness of a wafer before wafer processing. The wafer polishing apparatus according to the present invention includes a vacuum chuck which is provided with a wafer on the upper surface and fixes the wafer by forming vacuum pressure; a polishing machine which is disposed to be rotatable above the wafer and polishes the wafer; a light emitting unit which is arranged on the side of the wafer and irradiates light to a direction parallel to the upper surface of the wafer; and a wafer thickness measuring instrument having a light receiving portion for receiving the light irradiated from the light emitting unit.