Assembly for transporting substrates, assembly for handling substrates, assembly for producing electronic assemblies and method for handling substrates

摘要

The arrangement has a logistic module (4) which is formed for transport of the substrate (2) in an assembly line. The arrangement has a connecting device (17), which is formed such that the substrates are delivered from the logistic module to a robot module (10) for processing. The connecting device is formed for connecting and disconnecting the robot module during an operation of the logistic module. Independent claims are included for the following: (1) an arrangement for handling substrates; (2) an arrangement for manufacturing electronic assembly groups; and (3) a method for handling substrates by an arrangement.