发明名称 Portable electronic device with sensors chip and through-silicon vias
摘要 <p>The invention relates to a portable electronic device (2) with a housing (3) and several separate sensors (1; 1.1, 1.2, 1.3) placed inside the housing (3), the several sensors (1; 1.1, 1.2, 1.3) being designed to measure different physical quantities, wherein each sensor (1; 1.1, 1.2, 1.3) is designed as sensor chip with a substrate layer (4) and a sensing layer (5) placed on the substrate layer (4), wherein the sensing layer (5) comprises a signal processing circuit (6), and wherein the substrate layer (4) is provided with at least one via (7) for electrically connecting the signal processing circuit (6) of the sensing layer (5) to a contact pad (8) provided on the substrate layer side that is opposite to the sensing layer (5), the at least one via (7) extending from the substrate layer side that is adjacent to the sensing layer (5) to the opposite substrate layer side.</p>
申请公布号 EP2762840(A1) 申请公布日期 2014.08.06
申请号 EP20130405015 申请日期 2013.01.31
申请人 SENSIRION AG 发明人 MAYER, FELIX;LECHNER, MORITZ;GRAF, MARKUS
分类号 G01D11/24;H01L21/768;H01L23/48 主分类号 G01D11/24
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