发明名称 Substrate, substrate with thin film, semiconductor device, and method of manufacturing semiconductor device
摘要 <p>A substrate with a thin film, comprising: a substrate composed of silicon carbide and having a main surface having a diameter of 2 inches or greater; and a thin film composed of silicon carbide and formed on one said main surface, and a value for bow at said main surface being not smaller than -40 µm and not greater than 0 µm, and a value for warp at said main surface being not smaller than 0 µm and not greater than 40 µm.</p>
申请公布号 EP2762615(A2) 申请公布日期 2014.08.06
申请号 EP20140166214 申请日期 2010.04.06
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 HARADA, SHIN;SASAKI, MAKOTO;MASUDA, TAKEYOSHI
分类号 C30B29/36;C23C16/32;C23C16/42;C30B25/20;H01L21/02;H01L21/205;H01L21/329;H01L21/336;H01L21/337;H01L21/338;H01L29/12;H01L29/47;H01L29/78;H01L29/80;H01L29/808;H01L29/812;H01L29/861;H01L29/872 主分类号 C30B29/36
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