发明名称 |
Substrate, substrate with thin film, semiconductor device, and method of manufacturing semiconductor device |
摘要 |
<p>A substrate with a thin film, comprising: a substrate composed of silicon carbide and having a main surface having a diameter of 2 inches or greater; and a thin film composed of silicon carbide and formed on one said main surface, and a value for bow at said main surface being not smaller than -40 µm and not greater than 0 µm, and a value for warp at said main surface being not smaller than 0 µm and not greater than 40 µm.</p> |
申请公布号 |
EP2762615(A2) |
申请公布日期 |
2014.08.06 |
申请号 |
EP20140166214 |
申请日期 |
2010.04.06 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HARADA, SHIN;SASAKI, MAKOTO;MASUDA, TAKEYOSHI |
分类号 |
C30B29/36;C23C16/32;C23C16/42;C30B25/20;H01L21/02;H01L21/205;H01L21/329;H01L21/336;H01L21/337;H01L21/338;H01L29/12;H01L29/47;H01L29/78;H01L29/80;H01L29/808;H01L29/812;H01L29/861;H01L29/872 |
主分类号 |
C30B29/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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