| 摘要 |
<p>The present invention relates to a cooling plate and a soldering device having the cooling plate, comprising: a first cooling plate (210) having a first through-hole (211) formed in a lengthwise direction, first transfer grooves (212) formed to be spaced apart at a predetermined interval to transfer a high-temperature heat wave to the first through-hole (211) and an axis direction, and first discharging grooves (213) connected to the first transfer grooves (212) toward the axis direction to discharge the high-temperature heat wave; and a second cooling plate (220) formed on the bottom of one side of the first cooling plate (210), while having a second through-hole (221) elongated and connected to the first through-hole (211) to be penetrated by the solder, second transfer grooves (222) formed to be spaced apart at a predetermined interval to transfer the high-temperature heat wave to the second through-hole (221) toward the axis direction, and second discharging grooves (223) connected to the second transfer grooves (222) toward the axis direction to discharge the high-temperature heat wave.</p> |
