发明名称 SOLID STATE LIGHT EMITTING DIODE PACKAGES WITH LEADFRAMES AND CERAMIC MATERIAL AND METHODS OF FORMING THE SAME
摘要 Solid state light emitting diode packages can be provided including a ceramic material and a leadframe structure, on the ceramic material, the leadframe structure including a portion thereof that integrates the leadframe structure with the ceramic material.
申请公布号 EP2561559(A4) 申请公布日期 2014.08.06
申请号 EP20110772447 申请日期 2011.04.13
申请人 CREE, INC. 发明人 ANDREWS, PETER, S.
分类号 H01L33/00;H01L23/498;H01L33/48;H01L33/62;H01L33/64 主分类号 H01L33/00
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