IMAGING LENS UNIT

摘要

The present invention provides an imaging lens unit configured to be processed by the solder reflow process, can be miniaturized, and has sufficient thermal resistance for the reflow temperatures. The imaging lens unit also provides excellent optical characteristics such as transmissivity, a refractive index, and the like without deteriorating the optical characteristics in alignment of the centers of the lens and the diaphragm even after the reflow process, so as to contribute to reduction in the size and an increase in the capabilities. The imaging lens unit is configured to be processed by a solder reflow process, and includes a lens group consisting of one or more lenses; and a lens tube that supports the lens group, wherein the imaging lens unit comprises one or more cationically-cured epoxy resin lenses formed from an cationically-curable epoxy resin material, the lens tube is formed from a thermoplastic resin material having a deflection temperature under load of not lower than 200°C, and the imaging lens unit has a clearance between the lens tube and at least one of the cationically-cured epoxy resin lenses and has lens supporting portions that are provided at at least three locations inside the lens tube and that support the at least one cationically-cured epoxy resin lens.