| 摘要 |
The present invention relates to tetracarboxylic acid dihydride and polyimide silicone resin. More desirably, the present invention relates to polyimide silicone resin that can manufacture a film with excellent heat resistance, mechanical strength, solvent resistance, adhesion to a substrate, and transparency as the polyimide silicone resin is manufactured by polymerizing diamine containing an aliphatic ring structure and tetracarboxylic acid dihydride represented by chemical formula 1, and is heat-treated for a short period of time at low temperature using chemical formula 2 as a repeating unit. In chemical formula 1, R1 and R2 are C1-C6 aliphatic hydrocarbon groups or phenyl groups, respectively and independently, or R1 and R2 are rings formed by connecting adjacent carbons. In chemical formula 2, R1 and R2 are C1-C6 aliphatic hydrocarbon groups or phenyl groups, respectively and independently, or R1 and R2 are rings formed by connecting adjacent carbons, and R3 is an alicyclic hydrocarbon. |
