发明名称 Transparent conductive substrate
摘要 Disclosed are a transparent conductive substrate comprising a transparent conductive thin film layer and a transparent metal oxide layer disposed in this order on one or both surfaces of a substrate, the transparent metal oxide layer having numerous fine pores penetrating from the front surface to the rear surface thereof, and the pore diameters of the pores at the surface that is opposite to the surface that is in contact with the transparent conductive thin film layer being larger than those at the surface that is in contact with the transparent conductive thin film layer; and a method for producing the transparent conductive substrate, comprising forming the transparent metal oxide layer on the surface of the transparent conductive thin film layer or transparent conductive thin film layers by oblique deposition.
申请公布号 US8795786(B2) 申请公布日期 2014.08.05
申请号 US201113696879 申请日期 2011.05.11
申请人 Meihan Shinku Kogyo Co., Ltd. 发明人 Kawazoe Syozou;Hashimoto Kenji
分类号 H01L33/42 主分类号 H01L33/42
代理机构 Wenderoth, Lind & Ponack, L.L.P. 代理人 Wenderoth, Lind & Ponack, L.L.P.
主权项 1. A transparent conductive substrate comprising: a transparent conductive thin film layer and a transparent metal oxide layer disposed in this order on one or both surfaces of a substrate; the transparent metal oxide layer having numerous fine pores penetrating from the front surface to the rear surface thereof, and the pore diameters of the pores at the surface of the transparent metal oxide layer that is opposite to the surface of the transparent metal oxide layer that is in contact with the transparent conductive thin film layer being larger than those at the surface of the transparent metal oxide layer that is in contact with the transparent conductive thin film layer.
地址 Osaka JP