发明名称 Maintaining thermal uniformity in micro-channel cold plates with two-phase flows
摘要 A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.
申请公布号 US8797741(B2) 申请公布日期 2014.08.05
申请号 US201012909347 申请日期 2010.10.21
申请人 Raytheon Company 发明人 Altman David H.
分类号 H05K7/20;F28F7/00;F28D15/00;B21D53/02 主分类号 H05K7/20
代理机构 Daly, Crowley, Mofford & Durkee, LLP 代理人 Daly, Crowley, Mofford & Durkee, LLP
主权项 1. A cold plate system, comprising: a common inlet and a common outlet; first and second flow paths being hydraulically parallel between the common inlet and the common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system; the first flow path having a first inlet coupled to the common inlet, a first outlet coupled to the common outlet, and first and second orifices located between the first inlet and the first outlet, wherein the first orifice is spaced from the second orifice in the first flow path, the first and second orifices disposed in the first flow path on an inlet side of the first flow path, wherein the first and second orifices each protrude into the first flow path to reduce a cross-sectional area of the first flow path for constricting flow of the coolant; a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path; wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads; and a first card slot aligned with the first flow path to cool a first circuit card assembly seated in the first card slot and a second card slot aligned with the second flow path to cool a second circuit card assembly.
地址 Waltham MA US