Package structure

摘要

A package structure including a first semiconductor element, a second semiconductor element, a semiconductor interposer and a substrate is provided. The first semiconductor element includes multiple first conductive bumps. The second semiconductor element includes multiple second conductive bumps. The semiconductor interposer includes a connection motherboard, at least one signal wire and at least one signal conductive column. The signal wire is disposed on the connection motherboard. The two ends of the signal wire are electrically connected to one of the first conductive bumps and one of the second conductive bumps respectively. The signal conductive column is electrically connected to the signal wire. The substrate is electrically connected to the signal conductive column. The first and the second semiconductor elements have the same circuit structure. The substrate of the package structure can simultaneously form a signal communication path with the first and the second semiconductor element respectively.

主权项

1. A package structure comprising:
at least one first semiconductor element having a plurality of first conductive bumps; at least one second semiconductor element having a plurality of second conductive bumps; and a semiconductor interposer comprising:
a connection motherboard having a first surface and a second surface opposite the first surface and composed of at least one insulating layer;a first conductive layer disposed in the connection motherboard and including a plurality of wires; anda second conductive layer disposed in the connection motherboard and including a plurality of conductive columns;wherein the first conductive layer and the second conductive layer are electrically connected in the connection motherboard,at least one wire is exposed on the first surface and at least one conductive column is exposed on the second surface for electrically connecting the first surface to the second surface; wherein at least one wire is electrically connected to one of the plurality of first conductive bumps and one of the plurality of second conductive bumps and at least one conductive column is electrically connected to the at least one wire.