发明名称 Mold for resin molding, method for manufacturing mold for resin molding, and resin molded product
摘要 An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work.;The mold for resin molding of the present invention includes: a mold 12; a design layer 16 formed inside the mold 12; and a air permeable interposing layer 22 for forming the design layer 16 on an inner surface of the mold 12. The mold 12 forms a ventilating throughhole 14. The design layer 16 is made of a resin having projections and depressions on the surface, and has a ventilating throughhole 18 formed so as to couple to the ventilating throughhole 14. The air permeable interposing layer 22 is arranged next to the inner surface of the mold 12 so that an inner surface of the design layer 16, the ventilating throughhole 18 of the design layer 16, and the ventilating throughhole 14 of the mold 12 couple to each other.
申请公布号 US8794951(B2) 申请公布日期 2014.08.05
申请号 US200712517042 申请日期 2007.11.21
申请人 Tanazawa Hallosha Co., Ltd. 发明人 Yoneshima Sadayuki;Sakai Masayuki;Aota Hisao;Watanabe Hiroshi;Samejima Mitsuaki;Omiya Yumiko
分类号 B29C33/10;B29C33/40;B29C51/36 主分类号 B29C33/10
代理机构 Rabin & Berdo, P.C. 代理人 Rabin & Berdo, P.C.
主权项 1. A mold for resin molding, comprising: a mold; a design layer formed inside the mold; and an air permeable interposing layer configured to form the design layer on an inner surface of the mold; the mold having a ventilating throughhole; a die surface having fine projections and depressions being provided on the surface; the design layer having a thermosetting resin layer formed by pasting a sheet of thermosetting resin or by applying the thermosetting resin over the entire surface, having projections and depressions on a surface of the thermosetting resin layer, and forming a ventilating throughhole so as to connect to the ventilating throughhole of the mold; a curing temperature of the thermosetting resin of the design layer being selected based on an allowable temperature limit heatproof temperature of the mold; the design layer having a thickness of between 0.1 mm and 0.2 mm, and the design layer being made of resin that mixes whiskers; the air permeable interposing layer having a first air permeable adhesive layer to be bonded to an inner surface of the mold, which is formed by drying after applying the same thermosetting resin as that of the design layer to the mold in a thin layer as compared with an air permeable member without losing any ventilation characteristic, an air permeable member formed by drying after coating with the fibrous air permeable member dispersed in water on the top of the first air permeable adhesive layer, and the first air permeable impregnation layer formed by a resin forming the first air permeable adhesive layer, impregnated with the air permeable member and heated to cure with the first air permeable adhesive layer; the air permeable interposing layer having a second air permeable adhesive layer to be bonded to the design layer, which is formed by drying after applying the same thermosetting resin as the thermosetting resin forming the design layer to the surface of the air permeable member in a thin layer as compared with an air permeable member without losing any ventilation characteristic, and a second air permeable impregnation layer which is formed by a resin forming the second air permeable adhesive layer, impregnated with the air permeable member and heated to cure with the second air permeable adhesive layer; the design layer connecting to an inner surface of the mold by interposing the air permeable interposing layer so that a ventilating throughhole of the design layer, a ventilating throughhole of the mold and a ventilating pore of the air permeable interposing layer are connected to each other; the air permeable interposing layer having holes of between 0.01 mm and 0.2 mm forming one or more pore areas; a porosity of the one or more pore areas being within the range of 50% inclusive to 100% exclusive; and the air permeable member including a ventilating material that is resistant to the resin of the first air permeable adhesive layer.
地址 Osaka JP