| 摘要 |
A module with multiple duplexers provides both miniaturzation and cost reduction. Disclosed are a module substrate (100) which is characterized by including a multilayered wiring substrate (30) including multiple wiring layers (32a-32i), and multiple duplexers (20) embedded in the multilayered wiring substrate (30) to be electrically connected with the wiring layers (32), wherein the multiple embedded duplexers (20) include two duplexers corresponding to at least two bands among band 1, band 2, band 5, and band 8, and a module including the module substrate (100). |
