| 发明名称 |
METHOD FOR FORMING BONDED STRUCTURES AND BONDED STRUCTURES FORMED THEREBY |
| 摘要 |
A method of forming a bonded structure (10), such as for use in an automobile structure, comprises providing a first substrate (14) and a second substrate (16), and adding an adhesive region between the substrates, wherein the adhesive region has a first adhesive portion (18) and a second adhesive portion (12), and curing the first adhesive portion more quickly than the second adhesive portion, the method including positioning the substrates relative to one another and injecting the adhesive between said substrates to form an adhesive region while holding the substrates relative to one another. |
| 申请公布号 |
US2014212637(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201214006031 |
申请日期 |
2012.03.19 |
| 申请人 |
Syvret Andrew John;Pujol Sylvain |
发明人 |
Syvret Andrew John;Pujol Sylvain |
| 分类号 |
B29C65/52;B29C65/54;B32B7/12 |
主分类号 |
B29C65/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a bonded structure comprising:
providing a first substrate and a second substrate, adding an adhesive region between the substrates, wherein the adhesive region has a first adhesive portion and a second adhesive portion, and curing the first adhesive portion more quickly than the second adhesive portion. |
| 地址 |
Warwick GB |
