| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device including: first and second semiconductor chips mounted on a base substrate; a third semiconductor chip, which is mounted on the base substrate, and outputs control signals controlling operations of the first and second semiconductor chips; a first transmission transformer, which is mounted on the base substrate, and has a reception-side terminal connected to the third semiconductor chip and a transmission-side terminal connected to the first semiconductor chip; and a second transmission transformer, which is mounted on the base substrate, and has a reception-side terminal connected to the third semiconductor chip and a transmission-side terminal connected to the second semiconductor chip, wherein the control signals are transmitted from the third semiconductor chip to the first semiconductor chip and the second semiconductor chip individually through the first transmission transformer and the second transmission transformer. |
| 申请公布号 |
US2014210047(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201214240453 |
申请日期 |
2012.05.25 |
| 申请人 |
Tajima Kazunao;Tanaka Atsuhiko |
发明人 |
Tajima Kazunao;Tanaka Atsuhiko |
| 分类号 |
H01L49/02 |
主分类号 |
H01L49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a base substrate; first and second semiconductor chips mounted on the base substrate; a third semiconductor chip configured to output control signals controlling operations of the first and second semiconductor chips, the third semiconductor chip being mounted on the base substrate; a first transmission transformer having a reception-side terminal connected to the third semiconductor chip and a transmission-side terminal connected to the first semiconductor chip, the first transmission transformer being mounted on the base substrate; and a second transmission transformer having a reception-side terminal connected to the third semiconductor chip and a transmission-side terminal connected to the second semiconductor chip, the second transmission transformer being mounted on the base substrate, wherein the control signals are transmitted from the third semiconductor chip to the first semiconductor chip and the second semiconductor chip individually through the first transmission transformer and the second transmission transformer. |
| 地址 |
Niiza-shi JP |
