THERMAL SHOCK TEST DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thermal shock test device which can achieve quick and highly accurate temperature adjustment and is used for examining changes in physical properties of electric and electronic components such as semiconductor elements in response to thermal shocks under various temperature environments.SOLUTION: A thermal shock test device comprises: a low temperature chamber accommodating a first thermal storage body and having a Peltier element type cooler installed at its periphery; a high temperature chamber accommodating a second thermal storage body and having an electric heating type heater installed at its periphery; a medium temperature chamber disposed between the low temperature chamber and the high temperature chamber; a movable base which is alternately and repeatedly moved into the low temperature chamber and the high temperature chamber by way of the medium temperature chamber while having a test piece mounted on it; and a drier which supplies dry air to the low temperature chamber and the medium temperature chamber. The inside of the low temperature chamber is dried by the dry air from the drier and the temperature in the medium temperature chamber is maintained at normal temperature by the dry air from the drier.