| 摘要 |
An Sn-Ag-Cu-based solder powder is obtained by depositing, as an additive agent, on surfaces of a solder powder having an average particle size of not more than 5 µm, a dry substance of a solution of hydroxybenzoic acid having a melting point of not more than 250 ˚C or an ester thereof. It is preferable that the additive agent be salicylic acid, 3,4 dihydroxybenzoic acid ether, or 3,5 dihydroxybenzoic ether. It is preferable that: the deposited amount of the additive agent be 0.01-1.0 parts by mass per 100 parts by mass of the total amount of tin, silver, and copper components included in the solder powder; the content ratio of silver be 0.1-10 mass% when the total amount of tin, silver, and copper components is 100 mass%; the content ratio of copper be 0.1-2.0 mass% when the total amount of tin, silver, and copper components is 100 mass%; and the remainder comprise tin. |
