| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method and an apparatus which prevent bubble formation during immersion of a wafer and reduce the immersion time so as to maximize the plating uniformity of the wafer.SOLUTION: A substrate is immersed in an electrolyte in an electric plating cell 601 under a reduced-pressure condition of 100 torr or lower, preferably 20 torr or lower, to reduce or eliminate formation and/or capture of bubbles produced on immersion of a substrate. A variety of electrolyte recirculation loops for supplying an electrolyte to the plating cell 601 are disclosed. The recirculation loop may include a pump 606, a deaerator 608, a sensor 614, and a valve. Disclosed embodiments enable quick immersion of a substrate and substantial reduction of problems related to formation of bubbles and uneven plating times during electric plating.</p> |
