| 发明名称 |
THERMALLY AND ELECTRICALLY ENHANCED BALL GRID ARRAY PACKAGE |
| 摘要 |
In one embodiment, a device package is provided. The device package can include a substrate having first and second opposing surfaces, an opening being formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate. |
| 申请公布号 |
US2014210083(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201414229215 |
申请日期 |
2014.03.28 |
| 申请人 |
Broadcom Corporation |
发明人 |
Zhao Sam Ziqun;Khan Reza-ur Rahman;Law Edward;Papageorge Marc |
| 分类号 |
H01L23/00;H01L23/12 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device package, comprising:
a substrate having first and second opposing surfaces, wherein an opening is formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate. |
| 地址 |
Irvine CA US |
