| 摘要 |
<p>A method for producing a substrate having a pattern that is formed by etching, said method being characterized by comprising: a step wherein a resist film is formed by coating a substrate with a composition which contains, as a component (A), a resin that is obtained by reacting a crosslinking agent (a2) with a polyol (a1) that is selected from among a polybutadiene polyol, a hydrogenated polybutadiene polyol, a polyisoprene polyol and a hydrogenated polyisoprene polyol; and a step wherein the substrate, on which the resist film is formed, is patterned by etching.</p> |
