| 摘要 |
A semiconductor package includes a package substrate, a semiconductor chip, a die attachment film, a molding member, and a dummy finger. The bond finger is arranged on the upper surface of the package substrate. The semiconductor chip is arranged on the upper surface of the package substrate and is electrically connected to the bond finger. The die attachment film is interposed between the semiconductor chip and the package substrate and bonds the semiconductor chip and the package substrate. The molding member is formed on the upper surface of the package substrate and covers the semiconductor chip. The dump finger is formed between the upper surface of the package substrate and the molding member. |
