| 摘要 |
An objective is to provide a method for fabricating a semiconductor mounting substrate for preventing surface oxidization of a copper or a copper alloy by forming an organic anti-rust coating, reforming the organic anti-rust coating by UV ray irradiation before a dry film is stacked, and improving adhesion of a dry film resist while maintaining the anti-rust effect of copper or the copper alloy by the organic anti-rust coating. The semiconductor mounting substrate can be wound with a substrate material having a tape type so that the product yield can be improved even when a conventional fabrication apparatus is used. The method to achieve the objective includes: forming an organic anti-rust coating on a conductive layer by using a substrate material in a tape type having the conductive layer plated on the surface of a flexible member; reforming the organic anti-rust coating by irradiating the organic anti-rust coating by UV rays; stacking a photoresist on the organic anti-rust coating; forming the photoresist on a resist layer of a predetermined pattern; and forming a required circuit pattern by using the resist layer of the predetermined pattern. |
