| 摘要 |
<p>The present invention relates to a sealed package of a semiconductor chip and a processing method and, more specifically, to a sealed package of a semiconductor chip, which is manufactured by placing the semiconductor chip to be sealed from the outside on a lower wiring board chip including a metal wire for signal transmission, soldering a metal sealing unit formed on predetermined positions of the lower wiring board chip and an upper cover substrate which plays a role as a cover, and sealing the semiconductor chip, and a processing method for the same.</p> |
