Vertical integrated circuit switches, design structure and methods of fabricating same

摘要

Vertical integrated MEMS switches, design structures and methods of fabricating such vertical switches is provided herein. The method of manufacturing a MEMS switch, includes forming at least two vertically extending vias in a wafer and filling the at least two vertically extending vias with a metal to form at least two vertically extending wires. The method further includes opening a void in the wafer from a bottom side such that at least one of the vertically extending wires is moveable within the void.

主权项

1. A MEMS switch, comprising:
at least two vertically extending metal wires formed in a wafer; and a void formed in the wafer which accommodates at least one of the at least two vertically extending metal wires, wherein the at least one of the at least two vertically extending metal wires is moveable within the void upon an application of a voltage, and the at least two vertically extending metal wires are four wires and the at least one wire is two inner wires which are moveable within the void upon an application of the voltage.