Integrated circuit package with voltage distributor

摘要

An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.

主权项

1. An integrated circuit package, comprising:
a package support; a semiconductor die attached to the package support, wherein the semiconductor die has a plurality of peripheral bond pads along a periphery of the semiconductor die and a first bond pad on an interior portion of the semiconductor die, wherein the first bond pad is a bond pad for a first power supply voltage domain of the semiconductor die; a conductive distributor over the semiconductor die, wherein:
the conductive distributor is within a perimeter of the semiconductor die;the plurality of peripheral bond pads are located between the perimeter of the semiconductor die and a perimeter of the conductive distributor;the conductive distributor has a first opening, andthe first bond pad is in the first opening; a first bond wire connected to the first bond pad and the conductive distributor; and a second bond wire connected to a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.