LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING APPARATUS OF USE IT

摘要

Disclosed are a light emitting diode package and a light emitting device using the same. The light emitting diode package according to one embodiment of the present invention includes: a light emitting diode chip which is provided to emit light by receiving power; a substrate on which a light emitting diode is mounted; and a temperature sensor which measures the temperature of the light emitting diode chip. The light emitting device includes: the described light emitting diode package; and a control unit which is formed in the light emitting diode package and controls the emission of the light emitting diode chip according to the temperature measured by the temperature sensor.