| 发明名称 | Chemical mechanical polishing apparatus | ||
| 摘要 | A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer. | ||
| 申请公布号 | US8790158(B2) | 申请公布日期 | 2014.07.29 |
| 申请号 | US201113033876 | 申请日期 | 2011.02.24 |
| 申请人 | Samsung Electronics Co., Ltd. | 发明人 | Chang One-Moon;Boo Jae-Phil;Kim Jong-Bok;Tak Soo-Young;Ahn Jong-Sun;Kim Shin |
| 分类号 | B24B49/03;B24B49/12;B24B37/04 | 主分类号 | B24B49/03 |
| 代理机构 | Lee & Morse, P.C. | 代理人 | Lee & Morse, P.C. |
| 主权项 | 1. A chemical mechanical polishing apparatus, comprising: a platen having a first region configured to support a wafer and a second region disposed outside the first region; a polishing pad locatable on the platen; a pad head to which the polishing pad is attached; a slurry supply configured to supply a slurry onto the wafer; and an injection port disposed at the second region of the platen, and configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer, wherein the injection port has a closed loop shape extending along an outer circumference of the first region of the platen. | ||
| 地址 | Suwon-si, Gyeonggi-do KR | ||