| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electroplating method for avoiding occurrence of short circuit between upper and lower conductor circuit layers of an interlayer resin insulating layer caused by sludge and formation of a dint in an upper surface of a via conductor formed in a conductor circuit layer.SOLUTION: In the electroplating method, when an electroplating layer is formed on a surface of an object to be plated 3 by immersing the object to be plated 3 serving as a cathode into an electroplating bath into which a plating solution 1 is charged, and further immersing a net-like vessel 5 accommodating an anode metal 4 injected therein, and then applying an electric current to the object to be plated 3 and the anode metal 4, sludge S generated from the anode metal 4 in the net-like vessel during plating treatment is removed from the electroplating bath by sucking the sludge S together with the plating solution from the electroplating bath through a suction pipe 7 by a suction pump 8, then separating the sludge from the plating solution by passing the sucked plating solution through a microfiltration filter 9, and returning the plating solution separated from the sludge to the vicinity of the object to be plated 3 in the electroplating bath.</p> |
