| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic copper foil extremely useful as the electrode for an electronic device.SOLUTION: An electrolytic copper foil composed of copper or a copper alloy and used as the electrode for an electronic device has a 0.2% proof stress of 250 N/mmor more after heat treatment at 200°C for 60 min in nitrogen atmosphere, and comprises a recessed dominant surface, where the Pv/Pp of the maximum valley depth to the maximum peak height Pp of a profile, measured for a rectangular region of 181 μm×136 μm in accordance with JIS B 0601-2001 is 1.2 or more, on the at least one outer most surface of the electrolytic copper foil. |
