| 摘要 |
<p>The present invention relates to a method for manufacturing a printed circuit board, and a printed circuit board, the method comprising the steps of: forming, on one side of a substrate, a first metal film having a first surface and a second surface facing each other, whrein the first surface faces the substrate; forming, on the second surface of the first metal film, a second metal film having a third surface and a fourth surface facing each other, wherein the third surface faces the first metal film; and treating the second and/or the fourth surface with ultrasonic waves.</p> |
