| 摘要 |
<p>A wet wipe pad designed to be connected or attached to floor mop heads that utilize a hook-and-loop mechanism for attaching the wipe pad to the mop head. The wipe pad includes a cleaning layer ultrasonically welded to an attachment layer having an absorption layer disposed between the cleaning layer and the attachment layer. The wipe pad is configured with at least one linking ribbon or strip of fibers forming 'loops' extending along the length of the attachment layer for being releasably secured to 'hooks' disposed on the mop head.</p> |
