发明名称 COMPOSITION FOR FORMING TITANIUM-CONTAINING RESIST UNDERLAYER FILM AND PATTERNING PROCESS
摘要 <p>PROBLEM TO BE SOLVED: To provide a composition for forming a titanium-containing resist underlayer film for forming a resist underlayer film having excellent adhesiveness in fine patterning and excellent etching selectivity with a conventional organic film and a silicon-containing film.SOLUTION: The invention provides a composition for forming a titanium-containing resist underlayer film comprising: as component (A), a silicon-containing compound obtained by hydrolysis and/or condensation of one or more kinds of silicon compounds shown by the general formula (A-I) defined by RRRSi(OR); and, as component (B), a titanium-containing compound obtained by hydrolysis and/or condensation of one or more kinds of hydrolyzable titanium compounds shown by the general formula (B-I) defined by Ti(OR).</p>
申请公布号 JP2014134592(A) 申请公布日期 2014.07.24
申请号 JP20130001341 申请日期 2013.01.08
申请人 SHIN ETSU CHEM CO LTD 发明人 OGIWARA TSUTOMU;UEDA TAKASHI;TACHIBANA SEIICHIRO;TANEDA YOSHINORI
分类号 G03F7/11;G03F7/09;G03F7/26;H01L21/027 主分类号 G03F7/11
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