发明名称 HARDWARE ACCELERATED COMMUNICATIONS OVER A CHIP-TO-CHIP INTERFACE
摘要 A device and method for communicating, via a memory-mapped communication path, between a host processor and a cellular-communication modem are disclosed. The method includes providing logical channels over the memory-mapped communication path and transporting data organized according to one or more cellular communication protocols over at least one of the logical channels. In addition, the method includes acknowledging when data transfer occurs between the host processor and the cellular-communication modem, issuing commands between the host processor and the cellular-communication modem, and communicating and managing a power state via one or more of the logical channels.
申请公布号 US2014207991(A1) 申请公布日期 2014.07.24
申请号 US201414163846 申请日期 2014.01.24
申请人 Qualcomm Innovation Center, Inc. 发明人 Kaushik Vinod H.;Malamant Igor;Kolor Sergio
分类号 G06F13/38;G06F13/28;H04B7/26 主分类号 G06F13/38
代理机构 代理人
主权项 1. A method for communicating, via a memory-mapped communication path, between a host processor and a cellular-communication modem, the method comprising: providing logical channels over the memory-mapped communication path; transporting data organized according to one or more cellular communication protocols over at least one of the logical channels; acknowledging when data transfer occurs between the host processor and the cellular-communication modem; issuing commands between the host processor and the cellular-communication modem; and communicating and managing a power state via one or more of the logical channels.
地址 San Diego CA US