发明名称 MODIFIER FOR RESIN AND RESIN COMPOSITION USING THE SAME AND FORMED ARTICLE
摘要 A modifier for resin has an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.
申请公布号 US2014206817(A1) 申请公布日期 2014.07.24
申请号 US201414219808 申请日期 2014.03.19
申请人 MITSUBISHI RAYON CO., LTD. 发明人 WAKITA Tsuneki;Nakamura Keiji;Makino Hideaki;Osuka Masahiro;Miwa Yohei;Doi Yasutaka
分类号 C08L63/00 主分类号 C08L63/00
代理机构 代理人
主权项
地址 Tokyo JP