CHIP PACKAGE ASSEMBLY AND METHOD TO USE THE ASSEMBLY

摘要

The present invention relates to a chip package assembly (1) and its use for mounting and demounting of at least one semiconductor chip (2), comprising a flange (3) and a substrate (4), where the at least one chip (2) and the substrate (4) are arranged on one side of the flange (3). The flange (3) is composed of an electrical and thermally conducting material.