Methods and Apparatus for Inductors and Transformers in Packages

摘要

Methods and apparatus for forming a semiconductor device package with inductors and transformers using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top die and a bottom die, or between a die and an interposer. An inductor can be formed by a redistribution layer within a bottom device and a micro-bump line above the bottom device connected to the RDL. The inductor may be a symmetric inductor, a spiral inductor, a helical inductor which is a vertical structure, or a meander inductor. A pair of inductors with micro-bump lines can form a transformer.

主权项

1. A package, comprising:
a first device comprising a first redistribution layer (RDL); a micro-bump layer above the first device, comprising a first micro-bump line connected to the first RDL; and a first inductor comprising the first RDL and the first micro-bump line.