发明名称 APPARATUS AND METHOD FOR PLATING
摘要 <p>The present invention relates to an apparatus and a method for plating, the apparatus for plating comprising: a transporting part for transporting an object to be plated, the object comprising a pattern to be plated; and a cathode roller, of which at least the outer surface is electrically conductive, comprising a rotating shaft extending along one direction, and arranged so that the direction of the extension of the rotating shaft is at an incline and intersects with the direction of transport of the object to be plated.</p>
申请公布号 WO2014112817(A1) 申请公布日期 2014.07.24
申请号 WO2014KR00494 申请日期 2014.01.16
申请人 INKTEC CO., LTD. 发明人 CHUNG, KWANG CHOON;ON, WOONG KU;HAN, YOUNG KOO
分类号 C25D17/00;C25D17/12 主分类号 C25D17/00
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