发明名称 HEAT TRANSFER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a heat transfer substrate which prevents the deterioration of reliability and degradation that result from the deterioration of a joint part even if a heating element generating a large amount of heat is applied.SOLUTION: A heat transfer substrate includes: a metal plate 7; an insulation resin layer 8 laminated on an upper surface of the metal plate 7; and a heating element mounting substrate 9 which is embedded at the upper surface side of the insulation resin layer 8 and exposed only on an upper surface. A protruding part 11 which protrudes toward the heating element mounting substrate 9 side and has a plane part on a top surface is provided at a portion of the metal plate 7 which faces the heating element mounting substrate 9. The top surface is placed in contact with a bottom surface of the heating element mounting substrate 9.
申请公布号 JP2014135374(A) 申请公布日期 2014.07.24
申请号 JP20130002279 申请日期 2013.01.10
申请人 PANASONIC CORP 发明人 SHIMOYAMA KOJI;TSUMURA TETSUYA;ENDO KENJI
分类号 H01L23/36;H01L23/12;H01L23/467;H01L33/64 主分类号 H01L23/36
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