| 摘要 |
A die bonding device includes a wafer stage for supporting a wafer partitioned into multiple dies; and a die pickup unit for selectively picking up the dies and for transferring the dies to bond the picked up dies to a substrate. The die pickup unit includes a pickup head for picking up and transferring the dies; and a first collet which is mounted to the bottom of the pickup head through magnetic force to absorb the dies using vacuum. The first collet is shaped into a rectangle. The pickup head is shaped into a plate. The pickup head has first protrusions for corresponding to the short side of the first collet; and second protrusions for corresponding to the short side of the second collet to mount the second collet which is different from the first collet. |
