| 摘要 |
<p>The present invention relates to a method for producing solder balls (70), the method comprising: a first process in which core bodies (11) are attached to a surface (1a) of a base material (1) having a first adhesion layer (5); a second process in which second adhesion layers (13) are formed on surfaces (11a) of the core bodies (11); a third process in which solder particles (14) are attached to surfaces of the second adhesion layers (13); a fourth process in which the solder particles (14) are fused to form solder layers (15); and a fifth process in which the base material (1) is separated from the core bodies (11) so as to obtain solder balls.</p> |
