Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device

摘要

There is provided a thermosetting light-reflecting resin composition that has a high level of various characteristics required of optical semiconductor element mounting boards, such as optical properties and thermal discoloration resistance, provides high releasability during molding such as transfer molding, and allows molding processes to be performed continuously. There are also provided a highly-reliable optical semiconductor element mounting board and an optical semiconductor device each produced with the resin composition, and methods for efficient production thereof. A thermosetting light-reflecting resin composition is prepared and used, which includes (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent as major components, wherein the resin composition, after curing, has a diffuse reflectance of 80% or more at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding 100 times or more continuously.

主权项

1. A thermosetting light-reflecting resin composition, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing catalyst, (D) an inorganic filler, (E) a white pigment, (F) an additive, and (G) a release agent, wherein:
the white pigment (E) is a combination of inorganic hollow particles and at least one selected from the group consisting of alumina, magnesium oxide, antimony oxide, titanium oxide, and zirconium oxide; the additive (F) includes a triblock copolymer which is a compound represented by formula (III):wherein
l is an integer of 1 to 200, m1+m2 is an integer of 2 to 400, R1 is selected from the group consisting of an alkylene group having 1 to 10 carbon atoms, R2 and R3 are independently selected from the group consisting of: a monovalent organic group having 1 to 10 carbon atoms including at least one of an alkyl group, an aryl group, an alkoxy group, and an epoxy group; a monovalent organic group having 1 to 10 carbon atoms including a carboxyl group; and a polyalkylene ether group having 3 to 500 carbon atoms, and R4 is selected from the group consisting of a divalent hydrocarbon group having 1 to 10 carbon atoms;
the release agent (G) comprises a metallic soap having a structure represented by formula (1-1):
(R0—COO)qM1  (1-1) wherein R0 is a substituent selected from the group consisting of: a monovalent organic group having 3 to 50 carbon atoms including at least one of an alkyl group, an aryl group, an alkoxy group, and an epoxy group; a monovalent organic group having 3 to 50 carbon atoms including a carboxyl group; and a polyalkylene ether group having 3 to 500 carbon atoms,M1 is a metal element selected from the group consisting of: third period elements; Group IIA alkaline earth metal elements; and metal elements belonging to Groups IVB, IIB, VIII, IB, IIIA, IIIB, and IVA; andq is an integer of 1 to 4; andthe resin composition, after curing, has a diffuse reflectance of at least 80% at a light wavelength of 400 nm; and the resin composition is possible to perform transfer molding at least 100 times continuously.