发明名称 Anodic bonding method and method of producing acceleration sensor
摘要 An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area.
申请公布号 US8785292(B2) 申请公布日期 2014.07.22
申请号 US200912544480 申请日期 2009.08.20
申请人 Lapis Semiconductor Co., Ltd. 发明人 Sueyoshi Shinichi
分类号 H01L21/30 主分类号 H01L21/30
代理机构 Kubotera & Associates, LLC 代理人 Kubotera & Associates, LLC
主权项 1. An anodic bonding method of bonding a laminated substrate having a first planner dimension, comprising the steps of: preparing an anodic bonding apparatus having a first electrode and a second electrode, said first electrode having a first surface, said second electrode having a second surface facing the first surface and having a second planner dimension greater than the first planner dimension, said second electrode being formed of a material containing carbon as a main component, said first surface including a first central area; a first substrate placing area for placing the laminated substrate and containing the first central area; and a first peripheral area surrounding the first substrate placing area, said second surface including a second central area corresponding to the first central area; a second substrate placing area corresponding to the first substrate placing area and surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area, said second electrode further including a curved portion curved toward the first electrode so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area; placing the laminated substrate over the first central area and the first substrate placing area of the first electrode; a first contact step of contacting the second central area of the second electrode with the laminated substrate to form a contact area; a second contact step of contacting the second substrate placing area of the second electrode with the laminated substrate to enlarge the contact area with a stress applied by a fixing member disposed in the second peripheral area so that the second electrode is pressed against the laminated substrate until the second electrode becomes substantially flat; and a bonding step of applying a voltage to the first electrode and the second electrode to bond the laminated substrate, wherein, in the second contact step, said laminated substrate contacts with the second substrate placing area with a stress applied by first to fourth fixing units disposed at four corners of the second electrode, said second contact step including a first step of applying the stress at two of the four corners with the first and third fixing units and a second step of applying the stress at the other two of the four corners with the second and fourth fixing units.
地址 Yokohama JP