发明名称 Opto-electronic assembly for a line card
摘要 In one embodiment, the opto-electronic assembly is a hybrid integrated circuit having an array of avalanche photodiodes (APDs) that are electrically coupled to a corresponding array of transimpedance amplifiers (TIAs), with both the APDs and TIAs being mounted on a common ceramic substrate. The opto-electronic assembly further has an optical subassembly comprising an arrayed waveguide grating (AWG) and an array of turning mirrors, both attached to a temperature-control unit in a side-by-side arrangement and flip-chip mounted on the substrate over the APDs. The opto-electronic assembly employs a silicon-based submount inserted between the APDs and the substrate to accommodate the height difference between the APDs and the TIAs. The submount advantageously enables the placement of APDs in relatively close proximity to the turning mirrors while providing good control of the APD's tilt and offset distance with respect to the substrate. The temperature-control unit enables independent temperature control of the AWG and of the array of turning mirrors, which helps to achieve good optical-coupling efficiency between the AWG and the APDs even when the turning mirrors have a relatively small size.
申请公布号 US8787775(B2) 申请公布日期 2014.07.22
申请号 US201012944875 申请日期 2010.11.12
申请人 Alcatel Lucent 发明人 Earnshaw Mark P.
分类号 H04B10/06 主分类号 H04B10/06
代理机构 Mendelsohn, Drucker & Dunleavy, P.C. 代理人 Mendelsohn, Drucker & Dunleavy, P.C.
主权项 1. An apparatus, comprising: a support structure having a planar surface; a first planar substrate located at an offset distance from the planar surface and having a first optical device, the first optical device having an array of first optical ports along an edge of the first planar substrate; a second planar substrate located at an offset distance from the planar surface and having one or more second optical devices with second optical ports along a second edge of the second planar substrate, the second edge facing the first edge; a first heater thermally coupled to the first planar substrate; and a second heater thermally coupled to the second planar substrate, wherein: the first planar substrate has a substantially different thermal expansivity than the second planar substrate; andthe first heater and the second heater are configured to be separately controllable.
地址 Paris FR