Electrolytic method for filling holes and cavities with metals

摘要

Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

主权项

1. A galvanic method for filling cavities, blind holes or micro blind holes of a work piece with metals, comprising
bringing into contact the work piece containing cavities, blind holes or micro blind holes with a metal deposition electrolyte and applying a voltage between the work piece and at least one anode such that a current flow is fed to the work piece, and wherein the electrolyte contains a Fe(II)/Fe(III) redox system and the Fe(II) ion concentration is contained at at least 1 g/l and the Fe(III) ion concentration is contained at 7-30 g/l, and wherein the metal deposition predominantly occurs in the cavities, blind holes or micro blind holes, rather than at the surface of the work piece; wherein a first voltage is applied between a first side of the work piece and at least one first anode such that a first pulse reverse current is fed to the first side of the work piece, wherein at least one first forward current pulse and at least one first reverse current pulse flow in each cycle of said first pulse reverse current, a second voltage is applied between a second side of the work piece and at least one second anode such that a second pulse reverse current is fed to the second side of the work piece, wherein at least one second forward current pulse and at least one second reverse current pulse flow in each cycle of said second pulse reverse current.