| 发明名称 | Spray coatable adhesive for bonding silicon dies to rigid substrates | ||
| 摘要 | A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate. | ||
| 申请公布号 | US8785524(B2) | 申请公布日期 | 2014.07.22 |
| 申请号 | US201113168063 | 申请日期 | 2011.06.24 |
| 申请人 | Funai Electric Co., Ltd. | 发明人 | Wu Xiaoming;Dryer Paul;Rhine David;Pearson Anna;Singh Jeanne Marie Saldanha;Wells Richard;Provence Joel |
| 分类号 | C08K5/06;C08K5/07;C08L63/02 | 主分类号 | C08K5/06 |
| 代理机构 | Amster, Rothstein & Ebenstein LLP | 代理人 | Amster, Rothstein & Ebenstein LLP |
| 主权项 | 1. A spray coatable adhesive composition comprising an epoxy based resin, a thermal acid generator, a photo acid generator and a solvent, wherein the epoxy based resin consists of a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. | ||
| 地址 | Osaka JP | ||