| 摘要 |
An embodiment of the present invention relates to a horizontal heat treating apparatus accommodating a carrier to which a plurality of wafers is mounted. The horizontal heat treating apparatus includes a first gas supply pipe connected to a process tube for performing a vaporization reaction on surfaces of wafers using a reaction gas supplied into the process tube and a first cooling pipe provided in the process tube to supply a cooling gas to one side of the process tube; a second gas supply pipe for supplying a cooling gas to an opposite side of the process tube; an exhaust pipe for discharging a reaction gas introduced to form an oxide film on a wafer in the process tube; and a second cooling pipe formed in the process tube such that the cooling gas flows to an outer peripheral surface of the exhaust pipe. The second cooling pipe is connected to the second gas supply pipe, and the first cooling pipe includes branch pipes divided into at least two parts. The branch pipes are connected to the second cooling pipe under the branch pipes. |
